I-TRESKY soldering isebenzisa umusi we-formic acid kanye ne-nitrogen (HCOOH + N2), enikeza izinzuzo kubuchwepheshe be-optoelectronics kanye ne-photonics assembly kanye ne-interconnect. I-formic acid inciphisa ama-oxide ngokuthembekile futhi iqede ngokuphelele ukugeleza. Ukusetshenziswa kwe-formic acid kuqinisekisa nokumanzika okuhle kobuso, okudala izimo ezifanele zezinqubo zokushisela eziyinkimbinkimbi. Le module isetshenziselwa ukushisela i-eutectic kanye ne-thermocompression, isibonelo nge-indium. Zonke izinqubo zokubopha zisebenzisa i-formic acid ecebile nge-nitrogen (HCOOH) kusetshenziswa okuthiwa i-bubbler. Ingxube yomphunga we-nitrogen kanye ne-formic acid ifakwa ekamelweni lokwelapha ngendlela elawulwayo bese ikhishwa.